SPI Systems
Automated Inspection
Mek solder paste inspection (SPI) equipment is used to monitor and control one of the most critical steps affecting the finished quality of printed circuit boards (PCBs).
Solder paste deposition is the key process in board assembly operations and modern electronics manufacturing trends are increasingly abandoning costly repairs in favour of prevention through improved process control.
Research has identified that over 60% of end of line defects can be traced back to printing errors. Intercepting these defects before they happen reduces rework costs, provides instant yield improvement and accelerates return on investment.
