Advanced Rework & Die Bonding
Finetech BGA Rework
Finetech is the leading equipment manufacturer for sub-micron die bonding & advanced SMD rework. We provide solutions for each stage of your journey – from R&D to industrial automated production.
Finetech manufactures innovative, high-accuracy equipment for leading-edge bonding, micro assembly and rework challenges. The FINEPLACER® systems are designed to be modular for maximum process flexibility and come in manual, semi-automatic or automatic configurations.
Die Bonding
FINEPLACER® pico 2
Multi-purpose, manual die bonder with placement accuracy down to 3 µm’
FINEPLACER® femto pro
The fully automated FINEPLACER® femto pro, Finetechs fastest production die bonder to date, strikes the right balance between process flexibility, throughput and accuracy for the dynamic manufacturing of advanced photonics, power electronics and sensors.
FINEPLACER® sigma
Sub-micron placement accuracy with 450 x 150 mm2 working area and bonding forces up to 1000 N. Ideal for all types of precision die bonding and flip chip applications.
FINEPLACER® femto 2
Fully automated sub micron die bonder for advanced packaging applications. A complete machine enclosure ensures highly stable and fully controlled processes.
FINEPLACER® lambda 2
The versatile sub-micron table top flip chip bonder FINEPLACER® lambda 2 sets new standards in precision die attach and advanced chip packaging for opto-electronic assemblies and more.
Advanced Rework
FINEPLACER® pico rs
An enhanced hot air rework station for assembly and rework of all types of SMD components. The system is a best seller for professional mobile device rework in high density environments.
FINEPLACER® coreplus
A dedicated rework system that offers Finetech’s long proven rework technology for a wide spectrum of SMD components, ranging in size from 01005 to 90 mm x 90 mm.
