Must3

Solderability testing is used to determine if the solderable surface in question will wet.

In the case of BGA’s you are presenting the solder ball on the BGA to the molten solder of the pellet. As both materials are fusible the result you will get will be void.

There is nothing written in any standard stating what flux should be used when conducting solderability testing, but Actiec 5 is the best “all round” flux to consider using. For solderability testing using the bath any of the three fluxes maybe used. The weaker the flux the better the discrimination between good and poor solderability. 

The three fluxes available are:

1. SMNA is a pure rosin flux & is non- activated 

The SMNA is very weak, this flux should be used for Solder Bath Testing only.

1. Actiec 2 is 0.2% activated
2. Actiec 5 is 0.5% activated

For solderability testing with the globule Actiec 5 must be used on the globule. The flux applied to the component can be either Actiec 2 or 5. 

When testing large “Odd-form” components such as inductors, connectors, relays etc, the thermal mass of the component under test is substantial & the heat generated by the solder pellet is not enough to heat up the component. 

There are several ways to overcome this;

1. Try using the solder bath
2. Extending the test time
3. Use some form of pre-heat
4. Remove the leg from the component & testing this as an individual component

The below steps outline the correct procedure;

1. Bend away the adjacent legs to the leg being tested such that you are only presenting one leg of the component to the solder during the test
2. Present the leg of the component to the solder at an angle of 20° - 45° to the vertical - Solder to leg alignment is critical
3. Align the sole of the leg to ensure it meets the curved section of the solder pellet – NOT the top of the pellet - see Fig. 1

The MUST 3 Solderability Tester is designed to conduct solderability testing in full compliance with a wide range of industry standards, including IEC, IPC, MIL STD, EIA/JEDEC, ISO, JEITA, JNC, and many user-specific methods.

The MUST 3 comes with a comprehensive set of accessories, including baths and globules of various sizes (4mm, 3.2mm, 2mm, and 1mm), solder pellets (SnPb and Lead-free) appropriate for each globule size, a set of 13 clips to suit most components, a comprehensive solderability testing manual, and the NPL solderability testing best practice guide.

The MUST 3 helps reduce production costs by identifying solderability issues early in the process. This prevents costly rework or replacements later on, saving both time and resources. By ensuring components meet industry standards, you can avoid defects that lead to expensive repairs or product failures.

By ensuring that components have optimal solderability, the MUST 3 helps manufacturers achieve reliable solder joints, which are crucial for the proper functioning of electronic products. This testing prevents defects like poor soldering and cold joints, thereby enhancing overall product quality and reliability.

The temperature range for operation of the MUST3 should be between 5°C - 35°C.

The serial number is located on the back of the MUST3, this should be provided when seeking technical support.