Press Releases
Press Releases
GEN3 is pleased to announce exclusive partnership with Reliability Assessment Solutions Inc (RAS), a leader in advanced reliability testing solutions, the company partnered with RAS bringing the HATS²™ (Highly Accelerated Thermal Shock) Test System to the global electronics market via their global distribution network. Developed by RAS, HATS²™ is designed for Convection Reflow Assembly Simulation and Thermal Shock/Cycling, offering precise reliability and robustness evaluation of PCB (Printed Circuit Board) and substrate via structures, including plated through-holes (PTHs).
GEN3 are thrilled to announce our strategic partnership with Zestron, a renowned expert in electronic assembly quality and reliability.
Steve Collier - Regional Business Manager at Zestron Europe, Andrew Naisbitt - COE at GEN3,
Olaf Schoenfeld - European Sales Manager - Reliability solutions Zestron