Gen3 Systems Products to be displayed by Ascentech LLC at SMTAI in Booth 219 and at the Special SMTAi Feature Area

Gen3 Systems Products to be displayed by Ascentech LLC at SMTAI in Booth 219 and at the Special SMTAi Feature Area
24 September 2015

Gen3 Systems Limited, a specialist British manufacturer and distributor, announce that Ascentech LLC, their American Distributor, will exhibit both GEN3 Systems’ products and Optilia Inspection equipment on Booth #219 at the SMTA International Conference and Exhibition, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Ascentech LLC will also be participating in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience on the show floor. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.

Products on display will include the Solder Saver Solder/Dross separation tool, award-winning GENSONIC Ultra-Sonic Stencil Cleaner, the Optilia High Definition Camera Inspection System, the Optilia BGA Inspection scope and more.

Optilia offers obstruction‐free, fatigue‐free high‐definition benchtop inspection for PCB assembly and real‐time BGA inspection solutions.
The GENSONIC is a manually operated, ultrasonic transducer unit for cleaning stencils used in printing solder pastes and adhesives. It can be used either directly on the printer or at a separate cleaning station.

The Solder Saver is a hand held, compact system for separating dross from good solder. The unit easily reduces hardened dross material to oxide powder, making it possible to remove the dross oxide waste from the solder pot and leaving valuable solder in the pot.

Ascentech also will provide the Optilia HD camera system and GENSONIC Stencil Cleaner to this year's SMTAI Special Feature area, supported by SMTA & NPL. This year's special feature area will include live printing ultra-fine pitch deposits, 0201 and 01005 devices, inspection and measurement of different combinations of materials, plus some of the key in-process inspection steps to make a process perform correctly. It also will include AOI inspection of printed circuit board assemblies (PCBAs) for open joints, lifted leads, partial lifting of passives and other less common defects. A series of test boards have been specially created with known process defects to show the machines' capabilities