Process Qualification using the IPC-B52 Coupon
Abstract
Many professionals in the electronics manufacturing industry have, or eventually will, face the issue of determining whether the materials of construction for printed wiring assemblies (PWAs) are compatible with each other for the products produced, and producing objective evidence of this compatibility. Such a determination may be a monitoring or changing of an existing in-house manufacturing process, the development of a new manufacturing process, or determining if assemblies produced by a subcontractor are acceptable. The concept of materials compatibility can be very broad, depending on what factors are chosen for examination, but is critical to
understanding the reliability of manufactured hardware.
This paper focuses on the use of the IPC-B-52 standard printed wiring assembly as a test vehicle to meet these needs, with illustrative data from a high reliability avionics manufacturing process, including lead-free evaluations.
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