Industry research has identified that over 60% of end of line defects can be traced back to printing errors.
Intercepting and preventing these defects before they cause end of line reduces rework costs, provides instant yield improvement and accelerates return on investment.
Our 5D post-print solder paste inspection process incorporates patented new sensor technology and simultaneously combines 3D and 2D image processing methodologies that deliver defect detection beyond that previously possible.
Delivering true area, shape, offset, volume and height measurement in combination, SPI delivers true process control and provides the perfect solder paste printer adjustment tool.
Enabling manufacturers to correct printer settings before a problem spreads across an entire product, SPI delivers a major inspection breakthrough for unbeatable process reliability and optimal print results. More than just inspection, SPI is a process control and improvement tool.
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