Fineplacer Core
BGA Rework has become synonymous for SMT Rework in general. Many users’ needs focus around BGA/CSP/Flip Chip, so information found here provides a general background, applicable not only to array packages, but also to the broader SMT Rework market. Large sphere arrays (BGA), and small fine pitch arrays (CSP) demand configurations that combine precise thermal management and high resolution optics, to ensure a void-free rework process and accurate alignment.
Finetech provides a single platform that can perform the complete rework cycle:
- Melt solder and remove the defective component with a specialized nozzle design
- Residual solder removal using a contactless process - done in a single sweep, it produces safe, reproducible cleaning
- Printing of solder paste on PCB, direct component printing or dispensing
- Reball either a single defective ball or an entire array
- Placement and reflow of new component ensuring accurate alignment
We distribute equipment manufactured by some of the World's leading specialists, they are Marantz, ACE, Finetech, DIMA Technologies, Vacunest, Stoelting and MBTech.
