Solderability Testing

Assembling electronic circuits involves joining components to circuit boards. The "glue" used to achieve this is a solder alloy and involves melting the alloy at high temperature and then cooling it. If the surface of either the component or the board becomes oxidesed, even through improper storage, then this process results in defects that cost a huge amount of time and money to rectify - let alone compromising future reliability.

Consequently a reliable and repeatable measurement method was required and this gave rise to "solderability testing". The method uses a measurement of force in mN to determine the speed and extent of wetting and hence provide a go/no-go process control.

Lead-free soldering introduces new challenges in maintaining electronic product quality and reliability, and solderability testing is a proven quantitative method to help achieve this requirement.

MUST grandfathered this method and continues to set the standard by which others merely follow.

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