Testing Equipment
Gen3 Systems manufacture precision testing systems used by the electronics manufacturing and assembly industry to help maintain the highest possible standards in the assembly process.
Our equipment is able to give QUANTITATIVE measurements that have been scientifically determined as the most suitable methods for the given application:
- Solderability - Determining the usability and suitability of bare boards and components by measuring their solderability in mN
- Surface Insulation Resistance (SIR) - Measuring changes down to picoamp levels in the SIR caused by electro-chemical reactions on the surface
- Cathodic (Conductive) / Anodic Filamentation (CAF) - Measuring changes in resistance below the surface of the circuit board
- Solder Paste Analysis - A unique multi-purpose tester to analyse solder pastes and determine their usability
- Ionic Contamination (Cleanliness) - Measuring the amount of detectable contaminants from a board or assembly as a measure of its cleanliness
For more information about Conformal Coating visit our TECHSHOT section
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Force Measurement testing of Board and Component Solderability to all International Standards, IPC and IEC
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Ionic Contamination Testing ROSE, SEC Cleanliness Testing to IPC and MIL Standards
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Surface Insulation Resistance (SIR) Cathodic Anodic Filament (CAF) Testing to IPC and IEC Standards
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Solder Paste Analyser testing to both IEC and IPC Standards
