Technical Articles
Gen3 Systems technical articles describing material and process characteristics affecting the reliability of mission-critical electronics. These articles may be published with permission from Gen3 Systems
10th May 2012
COUNTERFEIT COMPONENT DETECTION USING SOLDERABILITY TEST METHODS
The MUST is a highly accurate system that measures the forces imposed on a component or a circuit board sample at levels as low as 0.001mN otherwise referred to as “wetting force”.
5th Mar 2010
For over 40 years, the electronics industry has been seeking ways to determine an answer to the thorny old question: How clean is clean?
28th May 2009
Put at its simplest, a standard is an agreed, repeatable way of doing something. It is a published document that contains a technical specification or other precise criteria designed to be used consistently as a rule, guideline, or definition.
19th Aug 2008
Previously found only in the lab, cleanliness testers are migrating to the production line as manufacturers realise their potential as a process control tool for lead free assembly. Graham Naisbitt explains what's behind the move
15th Aug 2008
Over one year into the implementation of Europe's RoHS directive, countries and states planning their own legislation are advised to study the European experience argues Graham Naisbitt
8th Aug 2008
Conformal coatings perform a vital role protecting electronics in tough environments. But the performance of the coating is dependent on how well it's applied, explains Graham Naisbitt
7th Aug 2008
SIR testing has formed he mainstay for high reliability electronics manufacturers. But the move to lead free solders has led to a review of the technique. Here Graham Naisbitt describes how SIR testing has adapted to meet the new challenge
30th Jul 2008
While the environmental reasons for eliminating lead from solder are laudable, the switch has put manufacturers on the back foot when it comes to determining the reliability of their products. IPC and IEC member Graham Naisbitt explains
29th Jul 2008
Solder paste analysis: Maintaining harmony between OEM and EMS
With the bulk of electronics assembly outsourced or offshored, OEMs are looking for new ways to ensure product quality and traceability. Quantitative testing of solder paste is a proven place to start says Graham Naisbitt
